During the past few decades, adhesive bonding technologies have attracted the attention of many researchers and engineers in different fields. Adhesively-bonded joints are more efficient than other types of joints, such as bolted or welding ones, due to their excellent features like having uniform load distribution, lighter weight, lower-cost manufacturing, faster and easier bonding process, and better thermal stability. Optomechanical and aerospace companies, such as TMT International Observatory, NASA, and Raytheon, are extremely interested in learning about the time-dependent behavior of adhesively-bonded joints, where adhesive creep characteristics can drastically affect the performance of the bonded joint over time.
The creep test of materials is one of the most expensive and time-consuming material tests requiring specialized equipment. Due to the complexity of the mechanism of failure in adhesively-bonded joints, the creep behavior of adhesively-bonded joints cannot be studied by a few numbers of creep tests, and it requires a batch of samples. Commercial creep-test machines are mainly designed for the creep test of metals, and they are meant to be only occupied by one specimen for a long time. One can see that occupying commercial creep-test machines for testing adhesively-bonded joints is expensive, and often not feasible. ASTM D2294 is the standard test method that describes the method of analyzing creep properties of adhesives with a suggested apparatus. However, careful analyzing the proposed apparatus reveals two important deficiencies: 1) The contemporary design potentially causes misalignment on the axial force; 2) the load applied on the specimen varies due to the deflection of the loaded spring.
In the first phase of this project, we shall design and prototype a new special apparatus for testing adhesive joints. This advanced and inexpensive device has the feature of running multiple creep tests for a batch of adhesively-bonded joints simultaneously. Its unique designed structure will collect consistent and accurate experimental data, which will be used for the next stage. In the second stage, we will use the theory of nonlocal operators to propose linear constitutive creeps models, instead of common nonlinear ones, to predict the deformation of a bonded joint over time. Then, we will expand the proposed model in an abstracted form, so engineers can easily use them in their simulation software.
The first generation of the creep apparatus designed for testing adhesive joints using 3M™ Scotch-Weld™ Epoxy Adhesive EC-2216 B/A Gray, which is a flexible, room temperature curing epoxies with high peel and sheer strength. The properties of this epoxy make it the first choice in Aerospace and Optomechanics industries. This particular apparatus was designed and prototyped that measures substantially small deformations under an applied pure shear test. The model of this first generation apparatus was structurally analyzed to assure pure shear stress. Besides, all the sensors including load cells and displacement sensors were calibrated carefully to guarantee the highest accuracy measurements.
The second generation of the creep apparatus designed for testing adhesive joints, which is more accurate with more accurate stress profile generator. It is fully automated, and using digital microscope (x1000) to obtain accuracy of 2 µm. It is also enhanced with a linear actuator along with a leverage system, which can generate up to 2000 N dynamic force.
The third generation of the creep apparatus designed for testing adhesive joints, which is the pioneer of its ancestor ADROCO Apparatus v2.0. The new version has a multitude of advantageous features:
In addition, the primary advantage of the machine is its ability to carry out simultaneous tests, limited only by size. The current iteration carries out four samples at a time, with each mechanism possessing its own linear actuator and load cell, guaranteeing simultaneous activation and measurement.